Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor chip assembly and fabrication method therefor

Semiconductor chip assembly and fabrication method therefor

US Patent 8035225 · Granted Oct 11, 2011

Estimated economic value: $64,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ink jet device2022
Air-conditioning device2020
Ink jet printing method printing a test substrate and a printing target2019
Wafer separating apparatus and wafer separating method2015
Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus2014
Circuit board and process for producing the same2014
Memory card2013
Method of manufacturing mounting structure and mounting structure2013
Semiconductor device mounted structure and its manufacturing method, semiconduct2013
Semiconductor device having stable signal transmission at high speed and high fr2013
Resin sealing structure for electronic component and resin sealing method for el2013
Circuit board and process for producing the same2012