Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal designs of packaged gallium nitride material devices and methods of packaging

Thermal designs of packaged gallium nitride material devices and methods of packaging

US Patent 8026596 · Granted Sep 27, 2011

Estimated economic value: $2,521,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical fin-based field effect transistor (FinFET) with neutralized fin tips2025
Method and system for fabricating fiducials for processing of semiconductor devi2025
Method and system for etch depth control in III-V semiconductor devices2025
Method and system for fabricating fiducials using selective area growth2025
Fabrication method for JFET with implant isolation2025
Methods and systems to improve uniformity in power FET arrays2025
Voltage source converters for power conversion in a HVDC power transmission netw2025
Method and system for control of sidewall orientation in vertical gallium nitrid2025
Method and system for fin-based voltage clamp2024
Coupled guard rings for edge termination2024
Method and system for fabrication of a vertical fin-based field effect transisto2024
Method and system of junction termination extension in high voltage semiconducto2024