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Home › System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

US Patent 8021928 · Granted Sep 20, 2011

Estimated economic value: $5,143,000 ⓘ

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