Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die down ball grid array packages and method for making same

Die down ball grid array packages and method for making same

US Patent 8021927 · Granted Sep 20, 2011

Estimated economic value: $4,548,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated antennas on side wall of 3D stacked die2025
Interconnection array device with support2025
Stress and warpage improvements for stiffener ring package with exposed die(s)2025
Cantilevered power planes to provide a return current path for high-speed signal2025
Photonics integration in semiconductor packages2024
Redistribution metal and under bump metal interconnect structures and method2021
Thin recon interposer package without TSV for fine input/output pitch fan-out2020
Redistribution metal and under bump metal interconnect structures and method2019
High density redistribution layer (RDL) interconnect bridge using a reconstitute2019
Heat spreader having thermal interface material retainment2018
Locating wireless-enabled components and applications thereof2018
Thin recon interposer package without TSV for fine input/output pitch fan-out2018