Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package with integrated heat sink

Integrated circuit package with integrated heat sink

US Patent 8018050 · Granted Sep 13, 2011

Estimated economic value: $27,405,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Coated semiconductor dies2023
Leads for leadframe and semiconductor package2023
Multi-die integrated circuit packages and methods of manufacturing the same2022
Methods for making a multilevel leadframe by etching a conductive sheet from two2020
Integrated circuit package having an IC die between top and bottom leadframes2019
Method for making lead frames for integrated circuit packages2018
Method for making lead frames for integrated circuit packages2018
Integrated circuit package fabrication with die attach paddle having middle chan2017
Integrated circuit package with die attach paddle having at least one recessed p2015
Integrated passive flip chip package2015
Method and apparatus for dicing die attach film on a semiconductor wafer2014
Methods and systems for packaging integrated circuits2011