Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-package slot array

Multi-package slot array

US Patent 7968989 · Granted Jun 28, 2011

Estimated economic value: $4,202,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Packaged integrated circuits having high-Q inductors therein and methods of form2016
Flip chip bump array with superior signal performance2016
Test assembly for verifying heat spreader grounding in a production test2014
Lead frame package2012
Package with improved connection of a decoupling capacitor2012
Package substrate with inserted discrete capacitors2010
Method and apparatus with power and ground strips for connecting to decoupling c2008
Stacked paddle micro leadframe package2007