Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397151 | Packaged integrated circuits having high-Q inductors therein and methods of forming same | Kenneth L. Astrof, Robert A. Gubser, Ajay Kumar Ghai, Viresh Piyush Patel | 2016-07-19 |
| 9332629 | Flip chip bump array with superior signal performance | — | 2016-05-03 |
| 8823407 | Test assembly for verifying heat spreader grounding in a production test | Errol Monsale | 2014-09-02 |
| 8294249 | Lead frame package | David J. Pilling, Diane Peng, Derek Huang | 2012-10-23 |
| 8120162 | Package with improved connection of a decoupling capacitor | — | 2012-02-21 |
| 7968989 | Multi-package slot array | Camille Kokozaki | 2011-06-28 |
| 7656007 | Package substrate with inserted discrete capacitors | — | 2010-02-02 |
| 7329958 | Method and apparatus with power and ground strips for connecting to decoupling capacitors | — | 2008-02-12 |
| 7166905 | Stacked paddle micro leadframe package | — | 2007-01-23 |