Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof

Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof

US Patent 7952192 · Granted May 31, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Molybdenum-silicon carbide composite powder and a fabricating method thereof2022
Electric conductive heat dissipation substrate2016
Thermoelectric material and method for manufacturing the same2015
Multi-layer thermoelectric module and method for fabricating the same2015
Thermoelectric module and method of fabricating the same2014
Protection structure forthermal dissipation and preventing thermal runaway diffu2014
Protection structure forthermal dissipation and preventing thermal runaway diffu2014
Metal thermal interface material and thermal module and packaged microelectronic2013
Metal thermal interface material and thermal module and packaged microelectronic2013
Thermally conductive, electrically insulating composite film and stack chip pack2012
Melting temperature adjustable metal thermal interface materials and application2009
Melting temperature adjustable metal thermal interface materials and application2009