Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadless semiconductor package and method of manufacture

Leadless semiconductor package and method of manufacture

US Patent 7943431 · Granted May 17, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lead frame routed chip pads for semiconductor packages2012
Lead frame routed chip pads for semiconductor packages2012
Partially patterned lead frames and methods of making and using the same in semi2012
Partially patterned lead frames and methods of making and using the same in semi2012
RF shielding for a singulated laminate semiconductor device package2011
RF shielding for a singulated laminate semiconductor device package2011
Reversible leadless package and methods of making and using same2011
Package having exposed integrated circuit device2011
No lead package with heat spreader2011
No lead package with heat spreader2011
Lead frame routed chip pads for semiconductor packages2010
Lead frame routed chip pads for semiconductor packages2010