Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit

Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit

US Patent 7939171 · Granted May 10, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and substrate2025
Semiconductor device and manufacturing method thereof2025
Method for manufacturing semiconductor device2024
Substrate cleaning apparatus and substrate cleaning method2024
Substrate cleaning apparatus and substrate cleaning method2022
Feature engineering method, apparatus, and system2022
Semiconductor device including multiple chips2021
Semiconductor device2021
Sheet material for extraction, extraction filter, and extraction bag2021
Electronic apparatus2020
Semiconductor device having lithography marks and resin portions in a cutting re2020
Semiconductor device package having a mounting plate with protrusions exposed fr2020