Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package-level electromagnetic interference shielding

Package-level electromagnetic interference shielding

US Patent 7928538 · Granted Apr 19, 2011

Estimated economic value: $5,406,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Radiation enhanced bipolar transistor2025
Flip chip backside mechanical die grounding techniques2023
Process enhancement using double sided epitaxial on substrate2021
Flip chip backside die grounding techniques2021
Flip chip backside die grounding techniques2020
Flip chip backside mechanical die grounding techniques2020
Methanol slicing of wine2019
Process enhancement using double sided epitaxial on substrate2019
Latchup reduction by grown orthogonal substrates2018
Process enhancement using double sided epitaxial on substrate2018
Latchup reduction by grown orthogonal substrates2017
Methods for fabricating radiation hardened MOS devices2017