Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process enhancement using double sided epitaxial on substrate

Process enhancement using double sided epitaxial on substrate

US Patent 11056490 · Granted Jul 6, 2021

Estimated economic value: $47,543,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Radiation enhanced bipolar transistor2025
Flip chip backside mechanical die grounding techniques2023
Flip chip backside die grounding techniques2021
Flip chip backside die grounding techniques2020
Flip chip backside mechanical die grounding techniques2020
Anneal after trench sidewall implant to reduce defects2019
Methanol slicing of wine2019
Formation of isolation layers using a dry-wet-dry oxidation technique2019
Process enhancement using double sided epitaxial on substrate2019
Process enhancement using double sided epitaxial on substrate2019
Latchup reduction by grown orthogonal substrates2018
Anneal after trench sidewall implant to reduce defects2018