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Home › Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer

Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer

US Patent 7927453 · Granted Apr 19, 2011

Estimated economic value: $459,000 ⓘ

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