Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and device for monitoring a heat treatment of a microtechnological substrate

Method and device for monitoring a heat treatment of a microtechnological substrate

US Patent 7846749 · Granted Dec 7, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for bonding chips to a substrate by direct bonding2025
Method for transferring chips2023
Method for direct bonding with self-alignment using ultrasound2019
Etching method for forming a carrier having inward side walls in particular for 2017
Device and method for individual support of components2016
Method for producing at least one pad assembly on a support for the self-assembl2016
Method for revealing emergent dislocations in a germanium-base crystalline eleme2011
Method for fabricating a semiconductor on insulator wafer2010