Stack type surface acoustic wave package, and method for manufacturing the same

Assignee

• Samsung

Inventors

• Seung Hee Lee (140 patents)
• Doo Cheol Park (6 patents)
• Joo Hun Park (6 patents)
• Young Jin Lee (149 patents)
• Sang Wook Park (185 patents)
• Nam Hyeong Kim (9 patents)

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