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Home › Method for forming buried cavities within a semiconductor body, and semiconductor body thus made

Method for forming buried cavities within a semiconductor body, and semiconductor body thus made

US Patent 7811848 · Granted Oct 12, 2010

Estimated economic value: $4,580,000 ⓘ

Assignee

Stmicroelectronics Sa

Inventors

Gabriele Barlocchi (53 patents)
Pietro Corona (23 patents)
Dino Faralli (18 patents)
Flavio Francesco Villa (70 patents)

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