Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

US Patent 7745263 · Granted Jun 29, 2010

Estimated economic value: $10,500,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and methods for managing aggregate integrated circuit (IC) current dem2019
Vertical magnetic barrier for integrated electronic module and related methods2018
Ball grid array including redistribution layer, packaged integrated circuit incl2016
Storing and removing device drivers in memory in imaging devices2015
Method and apparatus for optimizing memory usage in an imaging device2015
Method and apparatus for selective use of wear-leveling to store data in a memor2015
Enteral feeding device2015
Method and apparatus for printing raster page2015
Innovative verification methodology for deeply embedded computational element2014
Storing device drivers in imaging devices2014
Updating data in a one-time programmable data storage device2014
Method and apparatus for performing error diffusion among a plurality of pixels 2014