Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

US Patent 7732240 · Granted Jun 8, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Probe for testing an electrical property of a test sample2022
Deep-etched multipoint probe2018
Opto-electronic device package with a semiconductor-based sub-mount having SMD m2014
Fabrication process for package with light emitting device on a sub-mount2010
Formation of through-wafer electrical interconnections and other structures usin2010
Method of fabricating a package for a micro component2009
Formation of through-wafer electrical interconnections and other structures usin2009
Fabrication and use of polished silicon micro-mirrors2008
Multilayer piezoelectric motor2007
Piezoelectric motors and motor driving configurations2007
Resonance shifting2007
Multilayer piezoelectric motor2006