Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts

Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts

US Patent 8729591 · Granted May 20, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Web, sandwich plate, sandwich block and methods for producing same2024
Construction element having cover plates and tube segments made of a wood-based 2023
Probe for testing an electrical property of a test sample2022
Pallet comprising folded wooden composite2021
Pallet having panels and tube segments2021
Pallet having panels and tube segments2021
Deep-etched multipoint probe2018
Fabrication of compact opto-electronic component packages2014
Silicon-based sub-mount for an opto-electronic device2012
Surface mountable transducer system2012
Fabrication of compact opto-electronic component packages2010
Fabrication process for package with light emitting device on a sub-mount2010