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Home › Wafer bonded composite structure for thermally matching a readout circuit (ROIC) and an infrared detector chip both during and after hybridization

Wafer bonded composite structure for thermally matching a readout circuit (ROIC) and an infrared detector chip both during and after hybridization

US Patent 7723815 · Granted May 25, 2010

Estimated economic value: $7,469,000 ⓘ

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