Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363877 | Thermocompression bonding with passivated gold contacting metal | — | 2025-07-15 |
| 12363878 | Thermocompression bonding with passivated silver-based contacting metal | — | 2025-07-15 |
| 12356553 | Thermocompression bonding with passivated tin-based contacting metal | — | 2025-07-08 |
| 12245381 | Thermocompression bonding with passivated nickel-based contacting metal | — | 2025-03-04 |
| 12245379 | Thermocompression bonding using metastable gas atoms | — | 2025-03-04 |
| 12245380 | Thermocompression bonding with passivated copper-based contacting metal | — | 2025-03-04 |
| 11134598 | 3D packaging with low-force thermocompression bonding of oxidizable materials | — | 2021-09-28 |
| 10985024 | Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and products | — | 2021-04-20 |
| 10672594 | System and method for plasma head thermal control | Robert Emmett Hughlett, Matthew Sheldon Phillips, Michael Dow Stead | 2020-06-02 |
| 10438804 | Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and products | — | 2019-10-08 |
| 9909232 | Epitaxial growth using atmospheric plasma preparation steps | — | 2018-03-06 |
| 8592301 | Template wafer fabrication process for small pitch flip-chip interconnect hybridization | Justin K. Markunas | 2013-11-26 |
| 8567658 | Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds | — | 2013-10-29 |
| 8456004 | Template wafer and process for small pitch flip-chip interconnect hybridization | Justin K. Markunas | 2013-06-04 |
| 8163644 | Template process for small pitch flip-chip interconnect hybridization | Justin K. Markunas | 2012-04-24 |
| 7723815 | Wafer bonded composite structure for thermally matching a readout circuit (ROIC) and an infrared detector chip both during and after hybridization | Jeffrey M. Peterson | 2010-05-25 |
| 5880510 | Graded layer passivation of group II-VI infrared photodetectors | Charles A. Cockrum, David R. Rhiger | 1999-03-09 |
| 5646426 | Contact metal diffusion barrier for semiconductor devices | Charles A. Cockrum | 1997-07-08 |
| 5401986 | Bake-stable HgCdTe photodetector with II-VI passivation layer | Charles A. Cockrum, Francis I. Gesswein | 1995-03-28 |
| 5296384 | Bake-stable HgCdTe photodetector and method for fabricating same | Charles A. Cockrum, Francis I. Gesswein | 1994-03-22 |
| 5113076 | Two terminal multi-band infrared radiation detector | — | 1992-05-12 |
| 4970567 | Method and apparatus for detecting infrared radiation | William L. Ahlgren | 1990-11-13 |
| 4956304 | Buried junction infrared photodetector process | Charles A. Cockrum, Jeffrey B. Barton | 1990-09-11 |
| 4865245 | Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds | Eric Olson | 1989-09-12 |
| 4783594 | Reticular detector array | Ichiro Kasai | 1988-11-08 |