Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

US Patent 7662719 · Granted Feb 16, 2010

Estimated economic value: $3,260,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and UE for handling handover in wireless communication system2025
Coated sheets for improved additive manufacturing parts2024
Additive manufacturing powder particle, method for treating the additive manufac2024
Cognitive analysis of public communications2024
Coated powder for improved additive manufacturing parts2024
Plasma-treated powders for additive manufacturing2023
Coated sheets for improved additive manufacturing parts2023
Compliance management for emerging risks2023
Plasma-treated sheets for additive manufacturing2023
Additive manufacturing powder particle, method for treating the additive manufac2023
System and method for improving thermoset-thermoplastic interface adhesion2023
Methods for forming strengthened additive manufacturing materials and strengthen2023