Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die with aluminum-spiked heat pipes

Semiconductor die with aluminum-spiked heat pipes

US Patent 7646064 · Granted Jan 12, 2010

Estimated economic value: $4,431,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit (IC) chip comprising an identification circuit2018
Identification circuit and IC chip comprising the same2017
Self-propelled robotic device that moves through bodily and other passageways2012
Semiconductor wafer and die that include an integrated circuit and two or more d2012
Method of forming a semiconductor die with aluminum-spiked heat pipes2012
Cellular telephone handset with increased reception sensitivity and reduced tran2011
Bipolar transistor and method of forming the bipolar transistor with a backside 2011
Method of forming a metal interconnect with capacitive structures that adjust th2010
Power supply with reduced power consumption when a load is disconnected from the2010
Backside defect detector and method that determines whether unwanted materials a2010
Semiconductor die with an integrated inductor2010
MEMS semiconductor sensor device2009