Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal interface material for combined reflow

Thermal interface material for combined reflow

US Patent 7629203 · Granted Dec 8, 2009

Estimated economic value: $15,228,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level light-emitting diode array2023
Photocatalytic filter, method for manufacturing the same, and method for reactiv2023
Wafer level light-emitting diode array2021
Light emitting diode, method of fabricating the same and LED module having the s2021
Wafer level light-emitting diode array2020
Light emitting diode, method of fabricating the same and led module having the s2020
Light emitting diode and light emitting diode package2020
Light-emitting diode and application therefor2020
Light emitting diode and LED module having the same2020
Water purification system using ultraviolet LEDs2020
Light emitting diode, method of fabricating the same and LED module having the s2020
Light-emitting diode and application therefor2019