Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level packaging cutting method capable of protecting contact pads

Wafer-level packaging cutting method capable of protecting contact pads

US Patent 7622334 · Granted Nov 24, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micro light emitting diode display2025
Semiconductor light-emitting device2014
Method for wafer level packaging and fabricating cap structures2009
Method of fabricating optical device caps2009
Method for wafer level packaging and fabricating cap structures2009
Tunable optical add-drop multiplexer based on SOI wafer and manufacturing method2008
Method for bonding wafers2007
Method of forming a wafer backside interconnecting wire2006