Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

US Patent 7608485 · Granted Oct 27, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rapafucin derivative compounds and methods of use thereof2024
Rapadocins, inhibitors of equilibrative nucleoside transporter 1 and uses thereo2023
Rapafucin derivative compounds and methods of use thereof2021
Rapadocins, inhibitors of equilibrative nucleoside transporter 1 and uses thereo2020
Synthesis and composition of rapafucin libraries2020
Power amplifier2011
Semiconductor device with gold coatings, and process for producing it2011
Delivery management system2008
Multiple ground signal path LDMOS power package2004
Integrated circuit components thereof and manufacturing method2003
Alignment pedestals in an LDMOS power package2002
Integrated circuit, components thereof and manufacturing method2002