SH

Sam Hong

Ericsson: 6 patents #1,776 of 9,909Top 20%
The Johns Hopkins University: 5 patents #372 of 4,416Top 9%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Spånga, MD: #1 of 1 inventorsTop 100%
Overall (All Time): #402,373 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11945827 Rapafucin derivative compounds and methods of use thereof Jun Liu, Brett Ullman, Joseph Edward Semple, Kana Yamamoto, Puneet Kumar +2 more 2024-04-02
11555054 Rapadocins, inhibitors of equilibrative nucleoside transporter 1 and uses thereof Jun O. Liu, Jingxin Wang, Zhaoli Sun 2023-01-17
11066416 Rapafucin derivative compounds and methods of use thereof Jun Liu, Brett Ullman, Joseph Edward Semple, Kana Yamamoto, Puneet Kumar +2 more 2021-07-20
10774110 Rapadocins, inhibitors of equilibrative nucleoside transporter 1 and uses thereof Jun O. Liu, Jingxin Wang, Zhaoli Sun 2020-09-15
10662220 Synthesis and composition of rapafucin libraries Jun O. Liu, Jingxin Wang, Zufeng Guo, Wukun Liu, Hanjing Peng +1 more 2020-05-26
7608485 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology Henrik Hoyer, Jeffrey Hume 2009-10-27
6504232 Integrated circuit components thereof and manufacturing method Hans Norstrom, Bo Anders Lindgren, Torbjorn Larsson 2003-01-07
6406972 Integrated circuit, components thereof and manufacturing method Hans Norstrom, Bo Anders Lindgren, Torbjorn Larsson 2002-06-18
6251739 Integrated circuit, components thereof and manufacturing method Hans Norstrom, Bo Anders Lindgren, Torbjorn Larsson 2001-06-26
6211568 Electromigration resistant metallization structures and process for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold 2001-04-03
5920794 Electromigration resistant metallization process microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold 1999-07-06
5821620 Electromigration resistant metallization structures for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold 1998-10-13