Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit assembly with surface-mount IC package and heat sink

Circuit assembly with surface-mount IC package and heat sink

US Patent 7561436 · Granted Jul 14, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Waveguide with slot antennas and reflectors2025
Solderable waveguide antenna2025
Three-dimensional horn air waveguide antenna made with formed and brazed metal s2024
Electromagnetic interference shielding and thermal management systems and method2024
Formed waveguide antennas of a radar assembly2024
Multi-layered air waveguide antenna with layer-to-layer connections2024
Radar antenna system comprising an air waveguide antenna having a single layer m2024
Through board via heat sink2023
Heatsink shield with thermal-contact dimples for thermal-energy distribution in 2023
Plastic air-waveguide antenna with conductive particles2023
Liquid cooled module with device heat spreader2023
Apparatus, method and system comprising an air waveguide antenna having a single2023