Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Patterned plasma treatment to improve distribution of underfill material

Patterned plasma treatment to improve distribution of underfill material

US Patent 7550314 · Granted Jun 23, 2009

Estimated economic value: $21,941,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Precision battery energy measuring system2022
Precision current sensing using low cost sense resistance2021
Wire-based methodology of widening the pitch of semiconductor chip terminals2014
Media-compatible electrically isolated pressure sensor for high temperature appl2014
Media-compatible electrically isolated pressure sensor for high temperature appl2012
Media-compatible electrically isolated pressure sensor for high temperature appl2010
System and method to increase die stand-off height2009
Adhesion by plasma conditioning of semiconductor chip2008
Increased stand-off height integrated circuit assemblies, systems, and methods2008
Manufacturing system and apparatus for balanced product flow with application to2008
Adhesion by plasma conditioning of semiconductor chip2008
Adhesion by plasma conditioning of semiconductor chip surfaces2007