Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

US Patent 7528064 · Granted May 5, 2009

Estimated economic value: $2,582,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Charge storage apparatus and methods2025
Stack of horizontally extending and vertically overlapping features, methods of 2025
Anisotropic conductive film with carbon-based conductive regions having void spa2025
Methods of utilizing etch-stop material during fabrication of capacitors, integr2025
String driver assemblies including two-dimensional materials, and related memory2025
Three-dimensional stacking semiconductor assemblies and methods of manufacturing2025
Integrated assemblies having transistor body regions coupled to carrier-sink-str2025
Three dimensional memory and methods of forming the same2025
Driver placement in memories having stacked memory arrays2025
Integrated assemblies having voids along regions of gates, and methods of formin2024
Transistor structures having conductive structures along pillars of semiconducto2024
Methods and systems for manufacturing semiconductor devices2024