Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasma

Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasma

US Patent 7510964 · Granted Mar 31, 2009

Estimated economic value: $2,466,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Foldable board with flexible PCB coupling2020
Interlayer dielectric layer with two tensile dielectric layers2017
High transmittance thin film solar panel2017
Method for fabricating interlayer dielectric layer2016
Built-in FM transmitting antenna applied to a mobile device2014
Multifunction MEMS element and integrated method for making MOS and multifunctio2014
MEMS diaphragm2013
Method for fabricating semiconductor device2013
MEMS diaphragm2013
Method of transferring a wafer2012
Method of transferring a wafer2012
Method of transferring a wafer2012