Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers

Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers

US Patent 7476620 · Granted Jan 13, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical mechanical polishing (CMP) composition for shallow trench isolation (ST2018
Stable proton exchange membranes and membrane electrode assemblies2017
Chemical mechanical polishing (CMP) composition for shallow trench isolation (ST2016
Chemical-mechanical planarization composition having benzenesulfonic acid and pe2015
Chemical mechanical polishing (CMP) composition for shallow trench isolation (ST2015
Method for forming through-base wafer vias for fabrication of stacked devices2014
Chemical mechanical polishing (CMP) composition for shallow trench isolation (ST2014
Peroxide decomposition catalyst particles2014
Stable proton exchange membranes and membrane electrode assemblies2014
Fluoride-modified silica sols for chemical mechanical planarization2012
Dihydroxy enol compounds used in chemical mechanical polishing compositions havi2012
Dihydroxy enol compounds used in chemical mechanical polishing compositions havi2012