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Home › System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

US Patent 7443011 · Granted Oct 28, 2008

Estimated economic value: $6,661,000 ⓘ

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