Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit with re-route layer and stacked die assembly

Integrated circuit with re-route layer and stacked die assembly

US Patent 7422930 · Granted Sep 9, 2008

Estimated economic value: $818,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device for particle measurement and method for operating the semic2025
Radiation source device2024
Chip card body, method for forming a chip card body and chip card2024
Electronic inhalation apparatus with a chip module fixed with a folding structur2024
Sensor device, method for forming a sensor device, carrier tape, chip card and m2024
Tank apparatus for an electronic inhalation device, electronic inhalation device2023
Method and device for trimming an antenna applied on a carrier, method for produ2023
Sensor device, method of forming a sensor device, chip card and method of formin2023
Package, method for forming a package, carrier tape, chip card and method for fo2023
Electrical contact2022
Smart card module, method for producing a smart card module, smart card and meth2020
Chip card module and method for producing a chip card module2019