Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Array split across three-dimensional interconnected chips

Array split across three-dimensional interconnected chips

US Patent 7420832 · Granted Sep 2, 2008

Estimated economic value: $13,493,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Orthogonal impedance tuning and feed forward equalization for segmented multiple2025
Dual duty cycle correction loop for a serializer/deserializer (SerDes) transmitt2023
Matching transmitter impedance to receiver termination using an average of trans2020
Field effect transistor structure for reducing contact resistance2019
Field effect transistor structure for reducing contact resistance2019
Electromigration monitor2018
Bidirectional interface using thin oxide devices2018
Bidirectional interface using thin oxide devices2018
Bidirectional interface using thin oxide devices2018
Bidirectional interface using thin oxide devices2018
Implementing adaptive control for optimization of pulsed resonant drivers2016
Implementing adaptive control for optimization of pulsed resonant drivers2016