Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and systems for rapid prototyping of high density circuits

Methods and systems for rapid prototyping of high density circuits

US Patent 7419630 · Granted Sep 2, 2008

Estimated economic value: $45,228,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Spectral emissivity and temperature measurements of metal powders during continu2024
Metal additive manufacturing qualification test artifact2024
Wire embedding system with a curved delivery path2022
Method and system for powder bed fusion additive manufacturing of crack-free alu2022
Methods and apparatus for embedding a wire intermittently2021
Pipe mount2021
Metal objects spanning internal cavities in structures fabricated by additive ma2021
Structurally integrating metal objects into additive manufactured structures2021
Bracket2020
Extrusion-based additive manufacturing system for 3D structural electronic, elec2020
Extrusion-based additive manufacturing system for 3D structural electronic, elec2020
In-situ diagnostics and control method and system for material extrusion 3D prin2020