Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Module having stacked chip scale semiconductor packages

Module having stacked chip scale semiconductor packages

US Patent 7394148 · Granted Jul 1, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor multi-package module including tape substrate land grid array pack2015
Multiple chip package module having inverted package stacked over die2015
Adhesive/spacer island structure for stacking over wire bonded die2013
Semiconductor multi-package module including tape substrate land grid array pack2013
Method of fabricating a semiconductor multi-package module having wire bond inte2012
Stacked semiconductor package having adhesive/spacer structure and insulation2011
Plastic ball grid array package with integral heatsink2011
Semiconductor multi-package module having package stacked over die-up flip chip 2011
Integrated circuit package system including shield2011
Method for making semiconductor multipackage module including die and inverted l2010
Method of fabricating a semiconductor multipackage module including a processor 2010
Flip chip interconnection2010