Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-level printed circuit board interstitial vias

Multi-level printed circuit board interstitial vias

US Patent 7385472 · Granted Jun 10, 2008

Estimated economic value: $49,669,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Techniques for creating optimized pad geometries for soldering2008
Systems and methods for processing a set of circuit boards2007
Circuit board processing techniques using solder fusing2007
Techniques for manufacturing a circuit board having a countersunk via2007
Techniques for mounting a circuit board component to a circuit board2006
Micro soldered connection2004
Circuit board assembly which utilizes a pin assembly and techniques for making t2004
Systems and methods for distributing solder paste using a tool having a solder p2004
Systems and methods for disposing a circuit board component on a circuit board u2004
Systems and methods for manufacturing a circuit board2003
Techniques for forming a connection between a pin and a circuit board2003
Apparatus for manufacturing pcb's2003