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Techniques for creating optimized pad geometries for soldering |
Jin Liang, Larry Norris |
2008-08-26 |
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Multi-level printed circuit board interstitial vias |
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2008-06-10 |
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Systems and methods for processing a set of circuit boards |
Deborah Fragoza, Eric Ren, Thomas E. Knight |
2007-08-07 |
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Circuit board processing techniques using solder fusing |
Larry Norris, Jin Liang |
2007-01-09 |
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Louis H. Feinstein |
2007-01-02 |
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Techniques for mounting a circuit board component to a circuit board |
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2006-08-01 |
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2004-10-05 |
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2004-08-10 |
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2004-05-18 |
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Systems and methods for disposing a circuit board component on a circuit board using a soldering pin |
— |
2004-04-06 |
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Systems and methods for manufacturing a circuit board |
Jin Liang |
2003-10-28 |
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Techniques for forming a connection between a pin and a circuit board |
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2003-04-22 |
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Apparatus for manufacturing pcb's |
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2003-04-08 |
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Micro soldered connection |
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2002-11-19 |
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Timothy M. Mulvihill |
2002-11-12 |
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Verification gauge for an electronic package lead inspection apparatus |
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Method for manufacturing pcb's |
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2002-06-04 |
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Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape |
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2002-05-14 |
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2002-02-19 |
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Non-collapsing interconnection for semiconductor devices |
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2001-04-24 |
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Electrical contact for a printed circuit board |
Leonard A. Merrill |
2001-01-30 |
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Verification gauge for an electronic package lead inspection apparatus |
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2000-07-04 |
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Leonard A. Merrill |
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