Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heater chips with a reduced number of bondpads

Heater chips with a reduced number of bondpads

US Patent 7290864 · Granted Nov 6, 2007

Estimated economic value: $2,551,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for pairing a key with a vehicle via a vehicle communications 2022
System and method for pairing a key with a vehicle via a vehicle communications2020
Modular micro-fluid ejection head assembly2014
Printhead having a plurality of print modes2010
Methods and apparatus for optimizing energy supplied to a print head heater2010
Heater chip test circuit and methods for using the same2009
Methods and apparatuses for sensing temperature of multi-via heater chips2009
Methods and apparatuses for implementing multi-via heater chips2009
Methods and apparatuses for regulating the temperature of multi-via heater chips2009
Methods and systems to calibrate media indexing errors in a printing device2008
Power and ground buss layout for reduced substrate size2008
Power and ground buss layout for reduced substrate size2007