Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for low temperature plasma-enhanced bonding

System and method for low temperature plasma-enhanced bonding

US Patent 7261793 · Granted Aug 28, 2007

Estimated economic value: $27,598,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fluid ejection device with break(s) in cover layer2025
Thermally controlled reagent release2025
Loop heat pipe evaporator2025
Microfluidic devices2025
Processes for formation of molded panels by bringing release liner of mold chase2025
Molded structures with channels2024
Fluid-ejection die with stamped nanoceramic layer2024
Load balancing and secure tunneling for cloud-based network controllers2024
Coplanar modular printbars2024
Image identification method and system2024
Microfluidic devices with lid for loading fluid2024
Applying mold chase structure to end portion of fluid ejection die2023