Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates

Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates

US Patent 7258537 · Granted Aug 21, 2007

Estimated economic value: $7,896,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid cooled compliant heat sink and related method2019
Liquid cooled compliant heat sink and related method2019
Rinsing and drying for electrochemical processing2017
Rinsing and drying for electrochemical processing2015
Structures for improving current carrying capability of interconnects and method2015
Solder interconnect with non-wettable sidewall pillars and methods of manufactur2015
Working electrode design for electrochemical processing of electronic components2015
Additives for grain fragmentation in Pb-free Sn-based solder2014
Structures for improving current carrying capability of interconnects and method2014
Working electrode design for electrochemical processing of electronic components2014
Semiconductor package structures having liquid cooler integrated with first leve2014
Structures and methods to reduce maximum current density in a solder ball2014