Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package warpage control

Package warpage control

US Patent 7208342 · Granted Apr 24, 2007

Estimated economic value: $13,574,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Shampoo bottle2018
Flip chip assembly process for ultra thin substrate and package on package assem2016
Flip chip assembly process for ultra thin substrate and package on package assem2014
Process for assembling an integrated circuit package having a substrate vent hol2013
Flip chip assembly process for ultra thin substrate and package on package assem2012
Pants hat2010
Method of thinning a wafer utilizing a laminated reinforcing layer over the devi2004
Integrated circuit package having a substrate vent hole2002
TCP TAB design with radial outer leads1997
Control of pacing rate in dual-chamber, rate-adaptive pacemakers1997
Staggered land pad pattern on substrate for tab interconnection1997