Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for fabricating an integrated electronic circuit that incorporates air gaps

Process for fabricating an integrated electronic circuit that incorporates air gaps

US Patent 7172980 · Granted Feb 6, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectromechanical device packaging with an anchored cap and its manufacture2014
Copper diffusion barrier2014
Integration of self-aligned trenches in-between metal lines2013
Integration of self-aligned trenches in-between metal lines2013
MIM capacitor with enhanced capacitance2013
MIM capacitor with enhanced capacitance2013
Control of carbon nanostructure growth in an interconnect structure2013
Control of carbon nanostructure growth in an interconnect structure2013
Fabrication of a diffusion barrier cap on copper containing conductive elements2012
Fabrication of a diffusion barrier cap on copper containing conductive elements2012
Fabrication of a diffusion barrier cap on copper containing conductive elements2012
Method for forming metal interconnects in a dielectric material2012