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Home › Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer

Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer

US Patent 7163600 · Granted Jan 16, 2007

Estimated economic value: $382,000 ⓘ

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