Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for heating and cooling wafer at accelerated rates

System and method for heating and cooling wafer at accelerated rates

US Patent 7156924 · Granted Jan 2, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process condition sensing wafer and data analysis system2015
Process condition measuring device2012
Determining process condition in substrate processing module2011
Process condition sensing wafer and data analysis system2011
Integrated process condition sensing wafer and data analysis system2010
Process condition sensing wafer and data analysis system2010
Process condition sensing wafer and data analysis system2010
Pressure sensing device2010
Process condition measuring device and method for measuring shear force on a sur2009
Process condition sensing wafer and data analysis system2008
Methods of configuring a sensor network2008
Integrated process condition sensing wafer and data analysis system2006