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Home › Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

US Patent 7122475 · Granted Oct 17, 2006

Estimated economic value: $1,850,000 ⓘ

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