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Home › Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

US Patent 6794289 · Granted Sep 21, 2004

Estimated economic value: $1,886,000 ⓘ

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