Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic assembly with high capacity thermal interface and methods of manufacture

Electronic assembly with high capacity thermal interface and methods of manufacture

US Patent 7098079 · Granted Aug 29, 2006

Estimated economic value: $13,270,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus to minimize thermal impedance using copper on die backside2016
Microelectronic assembly including built-in thermoelectric cooler and method of 2014
Nanotube based vapor chamber for die level cooling2014
Flexible interconnect pattern on semiconductor package2013
Die having a via filled with a heat-dissipating material2013
Flexible interconnect pattern on semiconductor package2013
Process that includes assembling together first and second substrates the have r2013
Method and apparatus for two-phase start-up operation2012
Compact air-plus-liquid thermal management module2012
Flexible interconnect pattern on semiconductor package2012
Microarchitecture control for thermoelectric cooling2012
Cooling devices in semiconductor packages2012