Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module

Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module

US Patent 7086936 · Granted Aug 8, 2006

Estimated economic value: $17,815,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Measurement apparatus and method2018
Method and device for determining information relating to the mass of a semicond2018
Semiconductor wafer processing methods and apparatus2017
Measurement apparatus and method2016
Method of controlling semiconductor device fabrication2013
Method of controlling semiconductor device fabrication2013
Measuring apparatus2012
Measuring apparatus2012
Measuring apparatus2011
Methods and apparatus for sequentially alternating among plasma processes in ord2008
Platen with diaphragm and method for optimizing wafer polishing2006
Polishing pad conditioning and polishing liquid dispersal system2005